august 2005 asm3p1819n rev 0.2 alliance semiconductor 2575 augustine drive ? santa clara, ca ? tel: 408.855.4900 ? fax: 408.855.4999 ? www.alsc.com notice: the information in this document is subject to change without notice. low power mobile vga emi reduction ic features ? fcc approved method of emi attenuation ? provides up to 15db emi reduction ? generates a low emi spread spectrum clock and a non-spread reference clock of the input frequency ? optimized for frequency range from 20mhz to 40mhz ? internal loop filter minimizes external components and board space ? down spread deviation: -1.25% ? low inherent cycle-to-cycle jitter ? 3.3v operating voltage ? cmos/ttl compatible inputs and outputs ? low power cmos design ? supports notebook vga and other lcd timing controller applications ? power down function for mobile application ? products are available for industrial temperature range. ? available in 8 pin soic and tssop packages functional description the asm3p1819n is a versatile spread spectrum frequency modulator designed specifically for a wide range of input clock frequencies from 20 to 40mhz. the asm3p1819n can generate an emi reduced clock from crystal, ceramic resonator, or system clock. the asm3p1819n reduces electromagnetic interference (emi) at the clock source, allowing a system wide emi reduction for all the down stream clocks and data dependent signals. the asm3p1819n allows significant system cost savings by reducing the number of circuit board layers, ferrite beads, shielding, and other passive components that are traditionally required to pass emi regulations. the asm3p1819n modulates the output of a single pll in order to ?spread? the bandwidth of a synthesized clock, thereby decreasing the peak amplitude of its harmonics. this result in significantly lower system emi compared to the typical narrow band signal produced by oscillators and most clock generators. lowering emi by increasing a signal?s bandwidth is called ?spread spectrum clock generation?. the asm3p1819n uses the most efficient and optimized modulation profile approved by the fcc and is implemented by using a proprietary all digital method applications the asm3p1819n is targeted towards emi management for memory and lvds interfaces in mobile graphic chipsets and high-speed digital applications such as pc peripheral devices, consumer electronics and embedded controller system. block diagram vdd pd# vss modout xin frequency divider feedback divider modulation phase detector loop filte r vco output divide r pll crystal oscillator xout ref
august 2005 asm3p1819n rev 0.2 low power mobile vga emi reduction ic 2 of 7 notice: the information in this document is subject to change without notice. pin configuration pin description pin# pin name type description 1 xin i connect to externally generated clock signal or crystal. 2 vss p ground connection. connect to system ground. 3 nc - no connect. 4 modout o spread spectrum clock output. 5 ref o non-modulated reference clock output of the input frequency. 6 pd# i power down control pin. pull low to enable power-down mode. this pin has an internal pull-up resistor. 7 vdd p connect to +3.3v. 8 xout i connect to crystal. no connect if externally generated clock signal is used. absolute maximum ratings symbol parameter rating unit vdd, v in voltage on any pin with respect to ground -0.5 to +7.0 v t stg storage temperature -65 to +125 c t a operating temperature 0 to 70 c t s max. soldering temperature (10 sec) 260 c t j junction temperature 150 c t dv static discharge voltage (as per jedec std22- a114-b) 2 kv note: these are stress ratings only and are not implied for functional use. exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. output frequency and modulation rate input frequency range (mhz) output frequency range (mhz) modulation rate spread deviation (%) 20 to 40 20 to 40 input frequency / 512 -1.25 vss ref 1 2 3 5 6 7 8 asm3p1819n xin nc modout pd# xout vdd 4
august 2005 asm3p1819n rev 0.2 low power mobile vga emi reduction ic 3 of 7 notice: the information in this document is subject to change without notice. dc electrical characteristics (test condition: all parameters are measured at ro om temperature (+25c) unless otherwise stated) symbol parameter min typ max unit v il input low voltage vss ? 0.3 - 0.8 v v ih input high voltage 2.0 - vdd + 0.3 v i il input low current - - -20.0 a i ih input high current - - 1.0 a i xol x out output low current @ 0.4v, vdd = 3.3v - 3 - ma i xoh x out output high current @ 2.5v, vdd = 3.3v - 3 - ma v ol output low voltage vdd = 3.3v, i ol = 20ma - - 0.4 v v oh output high voltage vdd = 3.3v, i oh = 20ma 2.5 - - v i cc dynamic supply current 3.3v and 10pf probe loading 7.1 f in - min - 26.9 f in - max ma i dd static supply current - 4.5 - ma vdd operating voltage - 3.3 - v t on power up time (first locked clock cycle after power up) - 0.18 - ms z out clock output impedance - 50 - ? ac electrical characteristics symbol parameter min typ max unit f in input frequency 20 - 40 mhz f out output frequency 20 - 40 mhz t lh 1 output rise time ( measured from 0.8v to 2.0v ) - 0.69 - ns t hl 1 output fall time ( measured from 2.0v to 0.8v ) - 0.66 - ns t jc jitter (cycle to cycle) -200 - 200 ps t d output duty cycle 45 50 55 % note:1. t lh and t hl are measured into a capacitive load of 15pf
august 2005 asm3p1819n rev 0.2 low power mobile vga emi reduction ic 4 of 7 notice: the information in this document is subject to change without notice. package information 8-pin (150-mil) soic package d e h d a1 a2 a l c b e dimensions inches millimeters symbol min max min max a1 0.004 0.010 0.10 0.25 a 0.053 0.069 1.35 1.75 a2 0.049 0.059 1.25 1.50 b 0.012 0.020 0.31 0.51 c 0.007 0.010 0.18 0.25 d 0.193 bsc 4.90 bsc e 0.154 bsc 3.91 bsc e 0.050 bsc 1.27 bsc h 0.236 bsc 6.00 bsc l 0.016 0.050 0.41 1.27 0 8 0 8 note: controlling dimensions are millimeters soic ? 0.074 grams unit weight
august 2005 asm3p1819n rev 0.2 low power mobile vga emi reduction ic 5 of 7 notice: the information in this document is subject to change without notice. e h a a1 a2 d b c l e 8-lead thin shrunk small outline package (4.40-mm body) dimensions inches millimeters symbol min max min max a 0.043 1.10 a1 0.002 0.006 0.05 0.15 a2 0.033 0.037 0.85 0.95 b 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 d 0.114 0.122 2.90 3.10 e 0.169 0.177 4.30 4.50 e 0.026 bsc 0.65 bsc h 0.252 bsc 6.40 bsc l 0.020 0.028 0.50 0.70 0 8 0 8 note: controlling dimensions are millimeters tssop ? 0.0325 grams unit weight
august 2005 asm3p1819n rev 0.2 low power mobile vga emi reduction ic 6 of 7 notice: the information in this document is subject to change without notice. ordering information part number marking package configuration temperature range asm3p1819n -08-st 3p1819n 8-pin soic,tube commercial asm3p1819n -08-sr 3p1819n 8-pin soic, tape and reel commercial asm3p1819nf-08-st 3p1819nf 8-pin soic, tube, pb free commercial asm3p1819nf-08-sr 3p1819nf 8-pin soic, tape and reel, pb free commercial asm3p1819ng-08-st 3p1819ng 8-pin soic, tube, green commercial asm3p1819ng-08-sr 3p1819ng 8-pin soic, tape and reel, green commercial asm3i1819n -08-st 3i1819n 8-pin soic, tube industrial asm3i1819n -08-sr 3i1819n 8-pin soic, tape and reel industrial asm3i1819nf-08-st 3i1819nf 8-pin soic, tube, pb free industrial asm3i1819nf-08-sr 3i1819nf 8-pin soic, tape and reel, pb free industrial asm3i1819ng-08-st 3i1819ng 8-pin soic, tube, green industrial asm3i1819ng-08-sr 3i1819ng 8-pin soic, tape and reel, green industrial asm3p1819n -08-tt 3p1819n 8-pin tssop, tube commercial asm3p1819n -08-tr 3p1819n 8-pin tssop, tape and reel commercial asm3p1819nf-08-tt 3p1819nf 8-pin t ssop, tube, pb free commercial asm3p1819nf-08-tr 3p1819nf 8-pin tssop, tape and reel, pb free commercial asm3p1819ng-08-tt 3p1819ng 8-pin tssop, tube, green commercial asm3p1819ng-08-tr 3p1819ng 8-pin tssop, tape and reel, green commercial asm3i1819n -08-tt 3i1819n 8-pin tssop, tube industrial asm3i1819n -08-tr 3i1819n 8-pin tssop, tape and reel industrial asm3i1819nf-08-tt 3i1819nf 8-pin t ssop, tube, pb free industrial asm3i1819nf-08-tr 3i1819nf 8-pin tsso p, tape and reel, pb free industrial asm3i1819ng-08-tt 3i1819ng 8-pin tssop, tube, green industrial asm3i1819ng-08-tr 3i1819ng 8-pin t ssop, tape and reel, green industrial device ordering information asm3p1819nf-08-sr licensed under us patent #5,488 ,627, #6,646,463 and #5,631,920 o = sot u = msop s = soic e = tqfp t = tssop l = lqfp a = ssop u = msop v = tvsop p = pdip b = bga d = qsop q = q fn x = sc-70 device pin count x= automotive i= industrial p or n/c = commercial (-40c to +125c) (-40c to +85c) (0c to +70c) 1 = reserved 6 = power management 2 = non pll based 7 = power management 3 = emi reduction 8 = power management 4 = ddr support products 9 = hi performance 5 = s td z e r o d e l ay b u ff er 0 = r ese rv ed alliance semiconductor mixed signal product part number f = lead free and rohs compliant part g = green package r = tape & reel, t = tube or tray
august 2005 asm3p1819n rev 0.2 low power mobile vga emi reduction ic 7 of 7 notice: the information in this document is subject to change without notice. ? copyright 2003 alliance semiconductor corporation. all rights reserved. our three-point logo, our name and intelliwatt are trademarks or registered trademarks of alliance. all other brand and product names may be the trademarks of their respective companies. alliance reserves the right to make ch anges to this document and its products at any time without notice. alliance assumes no responsibility for any errors t hat may appear in this document. the data contained herein represents alliance's best data and/or estimate s at the time of issuance. alliance rese rves the right to change or correct this data at any time, without notice. if the product described herein is under development, significant changes to these specifications are possible. the information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not in tended to operate as, or provide, any guarantee or warrantee to any user or customer. alliance does not assume any responsibility or lia bility arising out of the applic ation or use of any product described herein, and disclaims any express or implied warrant ies related to the sale and/or use of alliance products including liability or warranties related to fitness for a particular purpose, mercha ntability, or infringement of any intellec tual property rights, except as express agreed to in alliance's terms and conditions of sale (which are available from alliance). all sales of alliance products are made exclusively according to alliance's terms and conditions of sale. the purchase of products from alliance does not convey a license under any pa tent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of alli ance or third parties. alliance does not aut horize its products for use as critical components in life-supporting systems where a malfunction or fa ilure may reasonably be expected to result in significant injury to the user, and the inclusion of alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify alliance against all claims arising from such use. alliance semiconductor corporation 2575 augustine drive, santa clara, ca 95054 tel# 408-855-4900 fax: 408-855-4999 www.alsc.com copyright ? alliance semiconductor all rights reserved part number: asm3p1819n document version: 0.2 note: this product utilizes us patent # 6,646,463 impedance emulator patent issued to alliance semiconductor, dated 11-11-2003
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